NEGATIVE RESIST NR9-1000PY

Description 

 

? Negative Resist NR9-1000PY is a negative tone photoresist designed for 365nm 

wavelength exposure using tools such as wafer steppers, scanning projection aligners, 

proximity printers contact printers. 

? After resist development, NR9-1000PY exhibits a negative-sloping resist sidewall profile, 

which facilitates a simple resist lift-off process. 

? These are the advantages of NR9-1000PY over other resists: - superior resolution capability - fast develop time - easy adjustment of the degree of resist undercut as a function of exposure energy - temperature resistance of up to 100°C - shelf life exceeding 3 years at room temperature storage. 

? The formulation processing of NR9-1000PY were designed with regard to 

occupational environmental safety. The principal solvent in NR9-1000PY is 

cyclohexanone development of NR9-1000PY is accomplished in a basic water 

solution. 

 

Properties 

 

    ?    Solids content (%)                                                                                      19-23                     

    ?    Principal solvent                                                                                         cyclohexanone 

    ?    Appearance                                                                                                light yellow liquid 

    ?    Coating characteristic                                                                                 very uniform,  

                                                                                                                              striation free 

    ?    Film thickness after 150°C hotplate bake for 60 s. 

           Coating spin speed, 40 s spin (rpm):                                                               (nm) 

             800                                                                                                            1900-2100      

2000                                                                                                      1170-1290 

3000                                                                                                      950-1050 

4000                                                                                                      817-903 

5000     712-788 

 

    ?    Sensitivity at 365 nm exposure wavelength (mJ/cm2 for 1 μm thick film)    390 

    ?    Guaranteed shelf life at 25°C storage (years)                                             3

Processing 

 

1. Application of resist by spin coating at ed spin speed for 40 s. 

 

2. Begin dispensing Edge Bead Remover EBR2 simultaneously onto the top bottom 

surfaces of the spinning, coated substrate through nozzles 0.5-1.0 cm the edge of 

the substrate as soon as edge bead forms (3-5 s after ceasing resist dispense). Stop 

dispensing EBR2 5 seconds prior to completion of spin coating cycle. 

 

3. 150°C hotplate bake for 60 s. (softbake). 

 

4. Resist exposure with a tool emitting 365 nm wavelength. 

 

5. 100°C hotplate bake for 60 s. (post-exposure bake). 

 

6. Resist development in Resist Developer RD6 by spray or immersion. 

Development time for 1 μm thick film, for example, is 10 s. 

To slow down development rate combine RD6/water 3:1 to achieve 55 s develop time for 

1 μm thick film. 

 

7. Resist rinse in deionized water until water resistivity reaches prescribed limit. 

 

8. Drying of resist. 

 

9. Removal of resist in Resist Remover RR4 at 110°C or in acetone. 

 

    Note: The above procedure refers to substrates, which are good conductors of heat such as  

    silicon, GaAs etc. Bake times need to be increased by a factor of 3.5 for substrates that are  

    poor conductors of heat such as glass. 

 

 

Hling Precautions 

 

Negative Resist NR9-1000PY is a flammable liquid. Hle it with care. Keep it away  

heat, sparks flames. Use adequate ventilation. It may be harmful if swallowed or touched. 

Avoid contact with liquid, vapor or spray mist. Wear chemical goggles, rubber gloves  

protective coating.