Description
? Negative Resist NR9i-3000PY is a negative tone photoresist designed for broadb i-
line (366 nm) exposure tools.
? After resist development NR9i-3000PY exhibits a negative-sloping resist sidewall profile,
which facilitates a simple resist lift-off process.
? The following are advantages of NR9i-3000PY over other resists:
- superior photospeed customizable photospeed to optimize exposure throughput
- superior resolution capability fast develop time
- easy adjustment of the degree of resist undercut as a function of exposure energy
- temperature resistance of up to 100°C
- easy resist removal in Resist Remover RR5
? The formulation processing of NR9i-3000PY were designed with regard to
occupational environmental safety. The principal solvent in NR9i-3000PY is
cyclohexanone development of NR9i-3000PY is accomplished in a basic water
solution.
Properties
? Solids content (%) 31-35
? Principal solvent cyclohexanone
? Appearance light yellow liquid
? Coating characteristic very uniform,
striation free
? Film thickness after 100°C hotplate bake for 300 s
Coating spin speed, 40 s spin (rpm): (nm)
800 5700-6300
3000 2850-3150
4000 2460-2720
5000 2140-2326
? Sensitivity at broadb exposure (mJ/cm2 for 1 μm thick film) 7
? Guaranteed shelf life at 23°C storage (years) 1
Processing
Application of NR9i-3000PY resist static dispense by spin coating at 3000 rpm for
40 s. Acceleration 0 to 3000 rpm is conducted in less than 1 s. Amount of dispensed
NR9i-3000PY is 7 mL per 6 inch diameter wafer.
Softbake on a hotplate at 110°C for 90 s.
Substrate cooling to room temperature.
Resist exposure with a tool emitting light at wavelengths shorter than 440 nm.
110°C hotplate bake for 90 s. (post-exposure bake)
Substrate cooling to room temperature.
Puddle resist development in Resist Developer RD6 for 35 seconds at 20-25°C or by
immersion development with agitation for 16 seconds at 20-25°C.
Resist rinse in fast flowing stream of deionized water until water resistivity reaches
prescribed limit then subsequent drying of resist.
Removal of resist in Resist Remover RR5 at room temperature.
The above procedure refers to substrates that are good
conductors of heat such as
silicon, GaAs, InP, etc. Hotplate temperatures need to be adjusted such that surface
temperature of substrates that are poor
conductors of heat reach designated
temperatures for softbake post-exposure bake. Always use external thermocouples
when measuring surface temperatures.
Hling Precautions
Negative Resist NR9i-3000PY is a flammable liquid. Hle it with care. Keep it away
heat, sparks flames. Use adequate ventilation. It may be harmful if swallowed or
touched. Avoid contact with liquid, vapor or spray mist. Wear chemical goggles, rubber
gloves protective coating.
Photoresist Characteristics
