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研究所课题专用、耐高温、干湿蚀刻专用PR1-9000A

发布日期:2024/11/26 16:48:12

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研究所课题专用、耐高温、干湿蚀刻专用PR1-9000A
深圳市芯泰科光电有限公司
产品热线许经理 :13玖23八66554  扣扣:35捌9123零

FUTURREX  POSITIVE RESIST  PR1-9000A
Description 
 
? Positive Resist PR1-9000A is a positive tone photoresist designed for 365 or 436 nm 
wavelength exposure, using tools such as wafer steppers, scanning projection aligners, 
proximity printers contact printers. PR1-9000A excels in applications when superior 
adhesion is required. Use of adhesion promoters, such as HMDS is not recommended 
with PR1-9000A. 
 
? The following are advantages of PR1-9000A over other resists: - superior resolution capability - fast photospeed - superior linewidth control due to suppression of reflective notching - substrate adhesion which is superior to that of any commercial positive resist - ease of removal after RIE process - shelf life exceeding 1 year at room temperature storage. 
 
? The formulation processing of PR1-9000A were designed with regard to occupational 
environmental safety. The principal solvent in PR1-9000A is 1-methoxy-2-propanol 
development of PR1-9000A is accomplished in a basic water solution.                            
Properties 
 
    ?    Solids content (%)                                                                                     43-47                       
    ?    Principal solvent                                                                                        1-methoxy-2-          
                                                                                                                             propanol 
    ?    Appearance                                                                                               light yellow liquid 
    ?    Coating characteristic                                                                                very uniform,  
                                                                                                                             striation free 
    ?    Film thickness after 115°C hotplate bake for 6 minutes. 
           Coating spin speed, 40 s spin (rpm):                                                         (nm) 
800                                                                                                             17100-18900 
2000                                                                                                           11276-12463 
3000                                                                                                           8550-9450 
4000                                                                                                           7738-8552 
5000                                                                                                           6716-7423 
           Sensitivity (mJ/cm2 for 1 μm thick film): 
       365 nm exposure wavelength                                                                   70 
           436 nm exposure wavelength                                                                   40 
 
    ?    Guaranteed shelf life at 25°C storage (years)                                           2   
Processing 
 
1. Application of resist by spin coating at ed spin speed for 40 s. 
2. Application of Edge Bead Remover EBR1 to bottom edge of the coated wafer for 10s, 
until 5 s before completion of spin cycle. 
3. 100°C bake in a bake oven for 15 minutes or 115oC hotplate bake for 240 s. 
4. Resist exposure with a tool emitting 365, 406 or 436 nm wavelengths. 
5. Resist development in Resist Developer RD6 by spray or immersion. 
6. Resist rinse in deionized water until water resistivity reaches prescribed limit. 
7. Drying of resist. 
8. Removal of resist in Resist Remover RR4 or in acetone. 
9. The above procedure refers to substrates, which are good conductors of heat such as 
silicon, GaAs etc. Bake times should be increased 3.5 times for substrates that are poor 
conductors of heat such as glass. 
 
 
Hling Precautions 
 
Positive Resist PR1-9000A is a flammable liquid. Hle it with care. Keep it away heat, 
sparks flames. Use adequate ventilation. It may be harmful if swallowed or touched. 
Avoid contact with liquid, vapor or spray mist. Wear chemical goggles, rubber gloves  
protective coating.