Description 

 

? Positive Resist PR1-12000A is a positive tone photoresist designed for 365 or 436 nm 

wavelength exposure, using tools such as wafer steppers, scanning projection aligners, 

proximity printers contact printers. PR1-12000A excels in applications when superior 

adhesion is required. Use of adhesion promoters, such as HMDS is not recommended 

with PR1-12000A. 

? These are the advantages of PR1-12000A over other resists: - superior resolution capability - fast photospeed - substrate adhesion which is superior to that of any commercial positive resist - ease of removal after RIE process - shelf life exceeding 1 year at room temperature storage. 

? The formulation processing of PR1-12000A were designed with regard to 

occupational environmental safety. The principal solvent in PR1-12000A is 1

methoxy-2-propanol development of PR1-12000A is accomplished in a basic water 

solution. 

                              

Properties 

 

    ?    Solids content (%)                                                                                  40-45                          

    ?    Principal solvent                                                                                     1-methoxy-2- 

                                                                                                                          propanol 

    ?    Appearance                                                                                            light yellow liquid 

    ?    Coating characteristic                                                                             very uniform,  

                                                                                                                          striation free 

    ?    Film thickness after 100°C oven bake for 15 minutes  

           Coating spin speed, 40 s spin (rpm):                                                           (nm) 

             800                                                                                                       23500-24500      

2300                                                                                                       14800-15200 

3000                                                                                                 11800-12200 

 

? Sensitivity (mJ/cm2 for 1 μm thick film): 

       365 nm exposure wavelength                                                                70 

           436 nm exposure wavelength                                                                40 

    ?    Guaranteed shelf life at 25°C storage (years)                                        1 

 

1. Application of resist by spin coating at ed spin speed for 40 s. 

 

2. Application of Edge Bead Remover EBR1 to bottom edge of the coated wafer for 10 

s, until 5 s before completion of spin cycle. 

 

3. 100°C bake in a bake oven for 30 minutes or 120oC hotplate bake for 180 s. 

 

4. Resist exposure with a tool emitting 365, 406 or 436 nm wavelengths. 

 

5. Resist development in Resist Developer RD6 by spray or immersion. 

 

6. Resist rinse in deionized water until water resistivity reaches prescribed limit. 

 

7. Drying of resist. 

 

8. Removal of resist in Resist Remover RR4 or in acetone. 

 

    The above procedure refers to substrates, which are good conductors of heat such as silicon,  

    GaAs etc. Bake times need to be increased 3.5 times for substrates, which are poor  

    conductors of heat such as glass. 

 

 

Hling Precautions 

 

Positive Resist PR1-12000A is a flammable liquid. Hle it with care. Keep it away  

heat, sparks flames. Use adequate ventilation. It may be harmful if swallowed or touched. 

Avoid contact with liquid, vapor or spray mist. Wear chemical goggles, rubber gloves  

protective coating.