Cu-BTA complex solid is s between pH 3~10. Cleaning solutions with
1. Buffered high pH solution
2. Reducing agent to control solution electrochemical property
3. Metal chelators to remove metal oxides/ions
4. Surfactants to remove organic inorganic residues
5. Corrosion inhibitors to minimize Cu corrosion
6. Concentrated aqueous solution for cost effectiveness
TMAH/H2O pH adjuster, buffered aqueous, Cu-BTA complex removal
(KOH)
Reducing agent Electro-potential control, buffer, Cu reducing
Metal chelator Metal oxide/ion removal, Cu-BTA complex removal
Surfactant Organic inorganic residue removal, surface wetting
Corrosion Cu corrosion control surface conditioning
Inhibitor
CEMI ZS-800 Series Solution Comparison
1. Dilution ratio can be tailor to customer process need.
2. CIP formulation with same concept can be tailor to customer requirements.
3. Actual TMAH% in Finished Good can be determined through titration.
4. ZS-800 equivalent POR reported actual TMAH% not input value.
5. ZS-802 formulation adopted an optimal buffer system to achieve lower Cu etch rate.
6. Local manufacturing in Taiwan.
CEMI ZS-802 Series pH Variation
1. Lowest good TMAH input amount of ZS-802 is 3.3%.
2. TAMH input amount is determined to be 3.8% for ZS-802 formulation design.
CEMI ZS-800 Dilution Ratio & Application Window
1. Excellent buffer property upon dilution is needed to ensure good performance.
2. ZS-800 series cleaning solution can be used at >100X dilution.
Tafel Plot Using ZS-800 Series as Electrolyte
Copper has lower corrosion rate in ZS-802A&ZS-802K than ZS-800 (POR).
CEMI ZS-800 Series Specs & CoA
