Description 

? Positive Resist PR1-2000A is a positive tone photoresist designed for 365 or 436 nm 

wavelength exposure, using tools such as wafer steppers, scanning projection aligners, 

proximity printers contact printers. PR1-2000A excels in applications when superior 

adhesion is required. Use of adhesion promoters, such as HMDS is not recommended 

with PR1-2000A. 

? These are the advantages of PR1-2000A over other resists: - superior resolution capability - fast photospeed - superior linewidth control due to suppression of reflective notching - substrate adhesion which is superior to that of any commercial positive resist - ease of removal after RIE process - shelf life exceeding 1 year at room temperature storage. 

? The formulation processing of PR1-2000A were designed with regard to occupational 

environmental safety. The principal solvent in PR1-2000A is 1-methoxy-2-propanol 

development of PR1-2000A is accomplished in a basic water solution. 

                              

Properties 

    ?    Solids content (%)                                29-31                   

    ?    Principal solvent                                                       1-methoxy-2- 

  propanol 

    ?    Appearance                                                               light yellow  

  liquid 

    ?    Coating characteristic                                                 very uniform,  

  striation free 

    ?    Film thickness after 100°C oven bake for 15 minutes. 

           Coating spin speed, 40 s spin (rpm):                                            (nm) 

             800                                                                        3800-4200      

2000 2340-2580 

3000 1900-2100 

4000 1634-1806 

5000 1424-1576 

 

? Sensitivity (mJ/cm2 for 1 μm thick film): 

     365 nm exposure wavelength                                                 70 

         436 nm exposure wavelength                                                  40 

    ? Guaranteed shelf life at 25°C storage (years)                                1  

Processing 

 

1. Application of resist by spin coating at ed spin speed for 40 s. 

 

2. 100°C bake in a bake oven for 15 minutes or 120oC hotplate bake for 60 s. 

 

3. Resist exposure in a tool incorporating 365, 406 or 436 nm wavelengths. 

 

4. Resist development in Resist Developer RD6 by spray or immersion. 

 

5. Resist rinse in deionized water until water resistivity reaches prescribed limit. 

 

6. Drying of resist. 

 

7. Removal of resist in Resist Remover RR4 or in acetone. 

 

The above procedure refers to substrates, which are good conductors of heat such as silicon, 

GaAs etc. Bake times need to be increased 3.5 times for substrates, which are poor 

conductors of heat such as glass. 

 

Hling Precautions 

 

Positive Resist PR1-2000A is a flammable liquid. Hle it with care. Keep it away heat, 

sparks flames. Use adequate ventilation. It may be harmful if swallowed or touched. Avoid 

contact with liquid, vapor or spray mist. Wear chemical goggles, rubber gloves protective 

coating.